Abishek D Praphullalumar
Sony has filed a new patent for a gaming controller featuring built-in heating and cooling pads to improve player comfort. The design, published on March 6, 2025, describes a “heat transfer module” that dynamically adjusts temperature based on grip conditions, such as cold fingers or sweaty palms.
The patent suggests the technology could be integrated into PlayStation DualSense controllers or used as an external module for other gaming peripherals like joysticks and steering wheels. While there is no guarantee this controller will be mass-produced, it highlights Sony’s ongoing research into innovative gaming hardware.
This latest development follows Sony’s pattern of controller-related innovations, including past patents for adaptive feedback and braille output. If brought to market, the heat-adjusting controller could set a new standard for immersive and ergonomic gaming experiences.
