Galaxy Z Flip7 Rumored to Feature Exynos 2500 Chipset

Samsung’s upcoming Galaxy Z Flip7 is rumored to be the first foldable smartphone to feature the Exynos 2500 chipset, according to a report from The Elec. This information was allegedly confirmed by a high-ranking Samsung official. The Exynos 2500 will be built using Samsung’s SF3 3nm process, offering a 10-core CPU with a 3.3 GHz prime core and an Xclipse 950 GPU featuring AMD RDNA architecture.

The chipset is expected to enter mass production in early 2025, aligning with the launch of the Z Flip7, which is typically released in July. Samsung plans to produce 229.4 million smartphones in 2025, with the Z Fold7 and a rumored Z Flip FE expected to account for a combined 3.9 million units. This marks a significant step in Samsung’s efforts to push its in-house Exynos chips into the foldable market

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