Apple is likely delaying the use of TSMC’s cutting-edge 2nm technology for its iPhone 17 series, with production yields currently at 60% and wafer output too low for mass adoption. While the A19 and A19 Pro chips could have benefited from TSMC’s 2nm process, astronomical costs and insufficient wafer production are key barriers.
It is estimated that by 2026, TSMC’s monthly 2nm wafer production could increase to 80,000 units, making it viable for mass production of the A20 and A20 Pro. Analyst Ming-Chi Kuo predicts Apple will skip 2nm chips for the iPhone 17 and likely introduce them with the iPhone 18 series. TSMC is also exploring cost-saving methods, such as the ‘CyberShuttle’ service, to reduce the price of the expensive $30,000 per wafer technology.
