MediaTek’s next-gen flagship chipset, the Dimensity 9500, is shaping up to be a serious contender in the mobile SoC race. Leaked details from reliable tipster Digital Chat Station reveal that it will be fabbed on TSMC’s advanced N3P node, with a groundbreaking all-big CPU core architecture and a dramatically improved AI engine.

The Dimensity 9500 is expected to feature a 1x Travis, 3x Alto, and 4x Gelas CPU layout. Travis and Gelas represent the upcoming ARM Cortex-X and Cortex-A7xx cores, with Travis rumored to push past 4GHz clock speeds. This CPU setup will be paired with 16MB L3 cache, 10MB system cache, LPDDR5X RAM (up to 10,667Mbps), and UFS 4.1 storage.

On the graphics side, an Immortalis-Drage GPU promises better ray tracing with lower power consumption. Meanwhile, AI tasks will see a huge leap thanks to the NPU 9.0, reportedly capable of delivering 100 TOPS a substantial jump from Dimensity 9400’s rumored 50-70 TOPS. Expect official details to surface later this year.
