TSMC has officially started small-scale production of 5,000 monthly 2nm wafers at its Baoshan plant in Taiwan. Following a successful trial with a 60% yield, the company is now moving ahead with fulfilling demand from major clients like Apple, Qualcomm, and MediaTek. The Taiwanese semiconductor giant also introduced an advanced variant, the N2P node, which is expected to enter mass production by 2026.
While TSMC’s capacity is currently limited, the firm is targeting a production ramp-up, with an anticipated 50,000 wafers per month by the end of 2025. By 2026, production could reach 80,000 units, though this remains unconfirmed for both the N2 and N2P processes. The company is also addressing the high cost of 2nm wafers, projected at $30,000, by launching the “CyberShuttle” service, which will allow multiple clients to share test wafers and reduce costs.
